1.自然科学基金联合基金重点项目,集成电路复杂封装检验的智能自适应检测与质量控制技术研究,主持
2.国家重点研发计划,高精度热压键合对准机制研究与装备开发,课题负责人
3.国家自然科学基金面上项目,齿轮箱多源稀疏表征与域分离感知深度迁移学习诊诊断方法研究,主持
4.国家自然科学基金面上项目,多源强噪下齿轮箱强时变非平稳故障特征提取及定量诊断研究,主持
5.江苏省重点研发计划,基于物联制造大数据的加工过程实时监测与主动控制,主持
6.江苏省前沿技术研发计划,面向异构算力集成的高可靠嵌入式桥接互连技术研发,主持
1.Yu Sun , Lei Su , Jiefei Gu , Xinwei Zhao , Ke Li* and Michael Pecht; Search for a Dual-Convergence Sparse Feature Extractor With Visualization Vibration Signals Architecture Feature for Flip-Chip Defect Detection, IEEE Transactions on Industrial Informatics, 2024, 20(8): 10134-10144
2.Yu Sun , Lei Su , Jiefei Gu , Xinwei Zhao , Ke Li* and Michael Pecht; Flip-chip solder bumps defect detection using a self-search lightweight framework, 2024, 60, 102395
3.Su Ding, Junjie Chen, Ke Li* and He Zhang, Fabrication strategies for metallic nanowire flexible transparent electrodes with high uniformity, Journal of Materials Chemistry A, 2024, 12, 18815
4.Siyu Zhang; Qiuju Zhang; Jiefei Gu; Lei Su; Ke Li*; Michael Pecht; Visual inspection of steel surface defects based on domain adaptation and adaptive convolutional neural network, Mechanical Systems and Signal Processing, 2021, 153: 107541
5.Lei Su; Shihong Tan; Yang Qi; Jiefei Gu; Yong Ji; Gang Wang; Xuefei Ming; Ke Li*; Michael Pecht; An improved orthogonal matching pursuit method for denoising high-frequency ultrasonic detection signals of flip chips, Mechanical Systems and Signal Processing, 2023, 188: 110030